Very low flux spatter, safer for operator useĪ zero-halogen wire optimized for robotic soldering applications, it provides consistent workability performance for both robotic and manual soldering in the electronics industry, with performance equivalent to conventional halogen/ halide-based systems.These solder rectangles do not contain flux, but rely on the excess flux present in solder paste to support reflow. It is ideal for electronic assemblies used in Automotive, Consumer Electronics, Computer and Peripherals, Mobile Devices and White Goods. ALPHA Exactalloy Solder Preforms in tape and reel packaging provide an easy to implement method for increasing solder volume specifically targeted for use with solder paste applications. Alpha Exactalloy solder preforms for wire harness and cable assembly are an aiding technology for the incorporation of PCBs into stand-alone soldering. Suitable for use in any electronic or industrial no-clean soldering application that specifies compliance to the IPC J-STD-004 ROL0 standard. Good spread characteristics: Excellent first pass solder joints.Solder Paste, Solder Preforms, Liquid Soldering Flux, Soldering Alloys. Can be used in both robotic and manual soldering processes. Alpha is a worldwide leader in the development, manufacturing and sales of. Performs well with all standard pad finishes. Available in many alloys, sizes and shapes. Preforms containing flux (external or core) do not require additional paste flux, liquid flux, or solder paste to form an effective solder joint. High solder volume precision and production yields using pick and place. can be used with any of Alpha’s flux coated or flux cored preforms. Very fast wetting: Excellent for drag soldering was specifically developed for temporary connection between a fluxed solder preform and a substrate.The inherent nature of the Innolot alloy provides a measure of tilt resistance during reflow for module to heat spreader applications. Multiple bondline control mechanisms can be included in a single solder preform to prevent tilt while ensuring a minimum bondline. It offers the balance of high SIR reliability and excellent spread characteristics. ALPHA Innolot Solder Preform Applications The melting range of the Innolot alloy matches closely with SnAg3.5, enabling an easy transition to the higher reliability product. ALPHA TrueHeight Preforms contain embedded bondline control wires that control the minimum bondline of the solder joint after reflow. Suitable for use in any commercial no-clean hand soldering application that specifies compliance to JIS grade AA standard. ALPHA ULTRA-CORE PREFORMS Technical Bulletin Issue: 02 October 2020 of 4.
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